Santa Barbara, CA, 29 January 2007:
Superconductor Technologies
Inc., a leading provider of high performance infrastructure products for
wireless voice and data applications, today announced Dr. Robert B. Hammond,
chief technical officer and senior vice president, is scheduled to present at
the International Wireless Industry Consortium (IWPC) Technology Exchange Forum
to be held at the Washington Duke Inn & Golf Club in Durham, NC on February 1,
2007.
The forum, titled "Handset Antenna Technologies
for Multi-Mode, Multi- Band," is being hosted by Sony Ericsson. The
presentations will focus on the needs of carriers for multi-mode, multi-band
handset antenna technologies and the challenges faced by the handset makers,
including what technology choices are currently or near term available to meet
future requirements for connectivity in all of the different frequency bands
required worldwide.
Dr. Hammond's presentation is titled "An Approach
to Tunable Thin Film Handset Duplexers."
About IWPC
The IWPC is a pro-active international community
of wireless and RF product OEMs and their suppliers. Its mission is to
facilitate communication up and down the entire supply chain to: identify and
clarify markets, products/service opportunities; reduce costs; improve
performance; and decrease time to market for all things wireless. More
information can be found at
http://www.iwpc.org.
About STI (Superconductor Technologies Inc.)
STI, headquartered in Santa Barbara, CA, is a
leading provider of high performance infrastructure products for wireless voice
and data applications. STI's SuperLink(R) solution increases capacity
utilization, lowers dropped and blocked calls, extends coverage, and enables
faster wireless data rates. Its AmpLink(TM) solution enhances the performance of
wireless base stations by improving receiver sensitivity and geographic
coverage.
SuperLink and AmpLink are trademarks of
Superconductor Technologies Inc. in the United States and in other countries.
For information about STI, please visit
www.suptech.com.
